0قضايا الاستقرار

لقد كان لديها بعض القضايا الاستقرار مع بلدي HTPC مؤخرا. A rein­stall did­n’t help so I con­cluded it was hard­ware. Remov­ing all non essen­tials did­n’t help either so I figured it must be وحدة المعالجة المركزية, الذاكرة أو موبو ذات الصلة. وفيركلوكيد شيء أو أنب وجميع الأخيرة إلى حد ما اسم العلامة التجارية لمجموعة. وأشدد على اختبار وحدة المعالجة المركزية والذاكرة دون أن تسبب إما أن تفشل, but I con­tin­ued to get occa­sion­al lockups and inter­mit­tent slug­gish performance.

Now because this is a htpc, it is in a smallish case with low air­flow. It has 2 120mm fans but they’re con­trolled based on وحدة المعالجة المركزية temp and are usu­ally off due to low وحدة المعالجة المركزية usage com­bined with the huge Scythe Ninja heat­sink. I knew the وحدة المعالجة المركزية was­n’t over­heat­ing but thought i’d check the gpu (A pass­ive Radeon 5450) and hdd, which is in a sus­pen­sion mount­ing which reduces the cool­ing it receives.

How­ever both hdd and gpu were barely luke­warm. In the pro­cess I happened to catch my hand on the fairly sub­stan­tial chip­set heat­sink (labelled “giga­byte” in the photo below). Ouch! I had­n’t real­ised that even with the sub­stan­tial cool­er the chip­set required or expec­ted some act­ive cool­ing from the nearby وحدة المعالجة المركزية sock­et. I don’t have a fan dir­ectly on the وحدة المعالجة المركزية heat­sink (as you can see below) and the air­flow over the chip­set clearly was­n’t suf­fi­cient. Ori­gin­ally I had the fans arranged blow­ing air out of the case, but decided to try a small rearrange­ment — revers­ing them and frac­tion­ally increas­ing their min­im­um speed. Pos­it­ive case pres­sure is gen­er­ally good prac­tice أي في اتجاه و, and this way air is forced past the heat­sink to exit the case. This small change seems to have done the trick.
Mor­al of the story: some recent(ish) chip­sets (e.g. Intel series 4 chip­sets) require reas­on­able air­flow (or a heat­sink upgrade — e.g. the Thermal­right HR-05 which is now on my shop­ping list).  It may also be a good idea to upgrade the thermal goop sup­plied with a high qual­ity com­pound. I recom­mend IC 7 Dia­mond if you can’t.
One final note — in my case the com­pan­ion south­bridge, with a tiny “heat­sink”, (cen­ter bot­tom of image) was only medi­um-warm and clearly does­n’t require any changes.