मेरे पास कुछ स्थिरता के मुद्दे हैं HTPC हाल ही में. एक पुनर्स्थापना ने मदद नहीं की इसलिए मैंने निष्कर्ष निकाला कि यह हार्डवेयर था. सभी गैर-जरूरी चीजों को हटाने में मेरी मदद नहीं हुई, इसलिए मुझे लगा कि यह होना चाहिए सीपीयू, मेमोरी या मोबो संबंधित. कुछ भी ओवरक्लॉक या ट्वीक नहीं किया गया है और इसके सभी हाल के ब्रांड नाम किट. मैंने तनाव का परीक्षण किया सीपीयू और स्मृति विफल होने के कारण या तो बिना, but I continued to get occasional lockups and intermittent sluggish performance.
Now because this is a htpc, it is in a smallish case with low airflow. It has 2 120mm fans but they’re controlled based on सीपीयू temp and are usually off due to low सीपीयू usage combined with the huge Scythe Ninja heatsink. I knew the सीपीयू wasn’t overheating but thought i’d check the gpu (A passive Radeon 5450) and hdd, which is in a suspension mounting which reduces the cooling it receives.
However both hdd and gpu were barely lukewarm. In the process I happened to catch my hand on the fairly substantial chipset heatsink (labelled “gigabyte” in the photo below). आहा! I hadn’t realised that even with the substantial cooler the chipset required or expected some active cooling from the nearby सीपीयू socket. I don’t have a fan directly on the सीपीयू heatsink (as you can see below) and the airflow over the chipset clearly wasn’t sufficient. Originally I had the fans arranged blowing air out of the case, but decided to try a small rearrangement — reversing them and fractionally increasing their minimum speed. Positive case pressure is generally good practice वैसे भी, and this way air is forced past the heatsink to exit the case. This small change seems to have done the trick.
Moral of the story: some recent(ish) chipsets (e.g. Intel series 4 chipsets) require reasonable airflow (or a heatsink upgrade — e.g. the Thermalright HR-05 which is now on my shopping list). It may also be a good idea to upgrade the thermal goop supplied with a high quality compound. I recommend I C 7 Diamond if you can’t.
One final note — in my case the companion southbridge, with a tiny “heatsink”, (center bottom of image) was only medium-warm and clearly doesn’t require any changes.
“Hi James I realise it has been a long while, but I just checked this on windows 11 (build 23H2)…”